why shall we use dehumidifier

       When electronic components are developing towards miniaturization and low cost, plastic packaging has become a standard practice. However, the wet gas will enter into the machine’s internal part through the joints between packaging materials and components.

       On one hand, it will cause oxidative corrosion of the internal short circuit; on the other hand, when the SMD device moisture absorption rate reaches 0.1wt%, the high temperature during welding in the assembly of electronic components inside the IC will enter the thermal expansion of wet gas to generate sufficient pressure , resulting the plastic separating from the chip or pin box,  damaging the line bundle and chip, and cracks ueder the surface. The crack will extend to the surface of components. The most serious case is components’ bulging and bursting, also known as "popcorn", which will lead to rework or even scrap the assemblies. it is more important that invisible and potential defects will dissolve into the product.

       Non-IC electronic components will also be harmed by humidity. Such as printed circuit boards’ moisture absorption rate of 0.2wt% will lead to cracks and delamination, silicon oxidation and other damage to the electronic components.

     Moisture damage to electronic components has become a very serious issue. Conseqently, dry-cabinet is uesed more and more widely.It can reduce the damage to the machines caused by humidity and extend the life of products.